发明名称 ALUMINUM NITRIDE CIRCUIT BOARD AND HIGH POWER MODULAR BOARD COMPRISING THE SAME
摘要 PROBLEM TO BE SOLVED: To solve the problem of an aluminum nitride circuit board that the average particle size of aluminum nitride crystal particles increasing up to about 10 μm in order to enhance heat dissipation but, when the particle size of aluminum nitride crystal particles is increased, the particle size of aluminum nitride crystal particles is varied or pores are generated to cause partial discharge. SOLUTION: The aluminum nitride circuit board comprises an aluminum nitride substrate and a metal circuit layer, wherein (thermal conductivity of the aluminum nitride substrate/thickness of the aluminum nitride substrate) is 300 kW/m2.K or above, extinction voltage (10 pC) of partial discharge is 6.0 kV or above, and 95% or more of aluminum nitride particles in the aluminum nitride substrate has a particle size in the range of 3-7 μm.
申请公布号 JP2002185092(A) 申请公布日期 2002.06.28
申请号 JP20000379450 申请日期 2000.12.13
申请人 TOSHIBA CORP 发明人 SHIRAI TAKAO
分类号 C04B35/581;H01L23/12;H01L23/15;H05K1/03 主分类号 C04B35/581
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