SEMICONDUCTOR DEVICE AND METHOD FOR FORMING CONTACT HOLE THEREIN

摘要

PROBLEM TO BE SOLVED: To form a contact hole opening onto a semiconductor substrate and a contact hole opening to a conductive part covered with a protective film easily with high accuracy. SOLUTION: A protective film 14 on a conductive part 11d for forming a contact hole 22 is removed previously by making an etching opening 20 for exposing the corresponding top part of the conductive part 11d from the surface of an insulation film 15 for burying the conductive part 11d covered with the protective film. The etching opening 20 is refilled with the same material as the insulation film 15 and then a contact hole 21 opening onto a semiconductor substrate 10 substantially having no protective film 14 and a contact hole 22 opening onto the conductive part 11d are formed simultaneously by etching under the substantially same conditions.