| 摘要 |
PROBLEM TO BE SOLVED: To prevent a conductive material entering a barrier metal and a conductive material formed on a substrate from diffusing into the substrate in the following process. SOLUTION: Unnecessary portions of the conductive materials 17, 18 that are formed on the barrier metal 16 formed on the surface of the substrate W, are to be a wiring and/or an electrode, and are positioned at the peripheral portion of the substrate W; and at least a part of the barrier metal 16 positioned nearer to the outside of the substrate W than the removed portions of the conductive materials 17, 18; are removed.
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