| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate for both-sided wiring board and a both sided wiring board comprising it in which the permittivity of an insulation layer can be lowered, while reducing dielectric loss sufficiently, even if an adhesive layer is provided. SOLUTION: The laminate for both sided wiring board comprises a surface metal layer 1, a surface resin porous layer 2 formed on the inner surface thereof, a rear metal layer 5, a rear resin porous layer 4 formed on the inner surface thereof, and an adhesive layer 3 for bonding the surface resin porous layer 2 and the rear resin porous layer 4. |
