发明名称 SEMICONDUCTOR ELEMENT HOUSING PACKAGE
摘要 PROBLEM TO BE SOLVED: To prevent an input/output terminal from cracking or breaking in brazing-bonding a metal frame to the input/output terminal, thereby improving the gas tightness of the brazing bond and the transmission characteristics of high frequency signals between a frame mount and the input/output terminal to normally and stably operate semiconductor elements packaged inside for a long time. SOLUTION: A metallized layer on the side of an input/output terminal 4 is narrowed in width at a boundary between a flat plate 4a and a vertical wall 4b.
申请公布号 JP2002184887(A) 申请公布日期 2002.06.28
申请号 JP20000385435 申请日期 2000.12.19
申请人 KYOCERA CORP 发明人 KAWAKAMI HIROSHI
分类号 H01L23/02;H01L23/04;(IPC1-7):H01L23/02 主分类号 H01L23/02
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