| 摘要 |
PROBLEM TO BE SOLVED: To protect a cleavage plane against damage in a cleavage process. SOLUTION: A semiconductor wafer 2 provided with marking-off lines corresponding to cleavage positions on its top surface is placed on the adhesive surface of an adhesive oriented sheet 3 whose ends are both firmly fixed, a convex stage 5 is arranged so as to make its longer direction parallel with the marking-off lines and lifted up to push up the semiconductor wafer 2, by which the semiconductor wafer 2 is cleaved along the marking-off lines. At this point, as the sheet 3 is oriented, the semiconductor wafer 2 is cut into several bars, the cleavage planes of the bars are hardly brought into contact with each other. |
