| 摘要 |
PROBLEM TO BE SOLVED: To make a protective film removing step to be able to be omitted from a method of manufacturing device including a step of dicing a wafer on which a worked portion, such as a pattern, etc., is formed after covering the surface of the wafer with a protective film. SOLUTION: After the surface of the wafer on which the worked portion 2 is formed is covered with the protective film 3 composed of camphor, the wafer is divided into individual chips 5. When a package 6 mounted with one chip 5 is heat-treated after the chip 5 is stuck to the upper surface of the package 6 by applying a die bonding agent 7 to the lower surface of the chip 5, the die bonding agent 7 is cured and the chip 5 is fixed on the package 6. At the same time, the protective film 3 on the surface of the chip 5 is naturally removed through sublimation by heat. |
