| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed board equipped with vias which can be micronized in diameter and wiring patterns which can be improved in density and a method of manufacturing the same. SOLUTION: A lower circuit 2 composed of a wiring and pads is formed on a board 1, and a first insulating layer 3 is formed thereon. A first filled via 6 is formed on the pad through the first insulating layer 3. A second insulating layer 7 thinner than the first insulating layer 3 is formed on the first insulating layer 3. A second filled via 9 smaller in diameter than the first filled via 6, a via pad 11A, and a wiring 11B are formed through the second insulating layer 7. |
