发明名称 SOLDERING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a soldering method by which conductors can be connected favorably to electrodes in a state where the surfaces of the electrodes are not eroded. SOLUTION: A coil is equipped with a winding 2 composed of a conductor and an insulating film coating the conductor and electrodes 5. On the surfaces of the electrodes 5, plated surface films composed of plated nickel films having thicknesses of >=0.5μm are formed. The conductors are connected to the electrodes 5 by soldering by adjusting the soldering temperature and dipping time so that the plated nickel films may not be eroded and the insulating films may be melted, and then, the constituent metals of the conductors and electrodes may form an alloy with the component of the solder.
申请公布号 JP2002185118(A) 申请公布日期 2002.06.28
申请号 JP20000379955 申请日期 2000.12.14
申请人 SANKEN ELECTRIC CO LTD 发明人 ISHIKAWA SHINICHI
分类号 B23K1/00;B23K1/08;B23K1/20;B23K31/02;B23K101/36;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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