| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for a semiconductor device which exhibits a high transmission efficiency of high-frequency signals. SOLUTION: The semiconductor package is provided with a substrate 1 which has a placing part 1a on its upper major surface for placing a semiconductor device 5, a frame 2 which is provided with a through hole 2b on its side for fitting a coaxial connector 3 and the coaxial connector 3 which is composed of a tubular peripheral conductor 3a, a central conductor 3b placed along its central axis, and an insulator 3c interposed between them and is fitted in the through hole 2b. The package is also provided with a shelf 2a on the top of which a circuit board 6 having a line conductor 6a on its surface of electrically connecting the semiconductor device 5, and the central conductor 3b is placed at the lower part of the through hole 2b on the inner surface of the frame 2. One end of the line conductor 6a connected to the central conductor 3b is a narrow part 6c whose width is 0.7-0.9 times as wide as that of the central conductor 3b, and the rest of it has approximately the same width as the central conductor 3b. |
