| 摘要 |
PROBLEM TO BE SOLVED: To provide a small and highly reliable high density optoelectronic printed wiring board, in which the laying work of optical fiber is convenient and the bend of an optical fiber can be managed. SOLUTION: On at least one side of a printed wiring board where an electric circuit pattern 4 is formed of a metal conductor, a trench 3 is made into an insulating layer 7 beneath the electric circuit pattern 4. An optical fiber 5 is laid in the trench 3 such that optical wiring and electrical wiring exist, mixedly in the same plane.
|
