| 摘要 |
PROBLEM TO BE SOLVED: To provide a evaporative cooling type power amplifier where the plastic resin of a module power semiconductor element is not brought into contact with refrigerant liquid. SOLUTION: A hole is made in the part of a wall 9b to which the module power semiconductor element 1b is fitted. The fitting face of the module power semiconductor element 1b is brought into contact with refrigerant liquid 4. The fitting face of the module power semiconductor element 1 operates as a heat dissipating part and the material is constituted of metal. Thus, it is no problem even if the fitting face is brought into contact with refrigerant liquid 4. An O ring 10 is inserted between the outer peripheral part of the fitting face of the module semiconductor element 1b and the wall 9b so that refrigerant liquid 4 does not invade an electric component storage 7 along the fitting face of the module power semiconductor element 1b.
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