| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable wiring board which can prevent the occurrence of micro-cracks, etc., in the connecting pad forming section of an insulating substrate and has connection pads having sufficient connecting strengths. SOLUTION: This wiring board is obtained by forming the connection pads 2 on the insulating substrate by respectively successively laminating metallic contact layers 2a, Cu layers 2b, Ni layers 2c, and Au layers 2d upon the substrate 1. The whole surfaces of the Cu layers 2b are covered with the metallic contact layers 2a and Ni layers 2c, and the end faces of the contact layers 2a, Ni layers 2c, and Au layers 2d are exposed.
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