| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which is equipped with a plurality of semiconductor elements different from each other in thickness and built inside and high in connection reliability. SOLUTION: The transition layer 38A of a thin IC chip 20A is made thick, and the transition layer 38B of a thick semiconductor device 20B is made thick. The top of the transition layer 38A of the thin IC chip 20A get flush with that of the transition layer 38B of the thick IC chip 20B, so that the transition layers 38A and 38B and the viahole 60 of an interlayer insulating layer 50 can be properly connected together. |
