| 摘要 |
PROBLEM TO BE SOLVED: To reduce heat resistance from a semiconductor device to a heat sink and to make the lengths and the shapes of gate wiring patterns from driving IC to a gate connection land to be uniform on a driving circuit board. SOLUTION: The semiconductor device 6 to which the driving circuit board 7 is fitted is fixed to the heat sink 8 across a heat dissipating insulating sheet 4. The semiconductor device 6 is constituted of a case 63 molding a bus bar 61 and a gate terminal 62, a semiconductor chip 64, solder 65 and a bonding wire 66. A projection 67 having a notch 68 and a pawl 69 at a tip is formed in the resin of the case 63. Since the semiconductor device 6 is fixed to the heat sink 8 by the projection 67, driving IC 71 can be arranged in the center of the driving circuit board 7. The wiring patterns 72 to the gate connection land 73 are made to be same lengths and same shapes, and the deviation of the driving timing of a gate can be prevented. |
