| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which can be manufactured through a smaller number of production processes and where vias can be easily formed, and to provide its manufacturing method. SOLUTION: This multilayer printed wiring board comprises a first process of forming the buried vias 51 and 52 by burying the punched conductive materials 5 in core insulating materials 8 and 81, a second process of forming core conductor layers 11 and 12 on the core insulating materials, a third process of forming an interlayer insulating layer 82 on the surfaces of the core insulating materials, and fourth process of boring a viahole 6 in the interlayer insulating layer for positioning its bottom at the end of the buried via. |
