发明名称 CONTAINER FOR SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To easily set a standard for mounting a semiconductor substrate or semiconductor chip, etc., raise the working efficiency to improve the workability, and stabilize the mounting accuracy of the semiconductor substrate or semiconductor chip, etc., to improve the mounting position accuracy. SOLUTION: The container comprises a container body 11 having a plurality of scribing lines 14, 15 on the bottom, semiconductor substrates 12, 13 having metallizing marks 16 related to the scribing lines 14, 15 and a semiconductor chip 17. For mounting the semiconductor substrates 12, 13 and the semiconductor chip 17 in the container body 11, the metallizing marks 16 are superposed on the scribing lines 14, 15 to position the semiconductor substrates 12, 13 and the semiconductor chip 17.
申请公布号 JP2002184892(A) 申请公布日期 2002.06.28
申请号 JP20000375981 申请日期 2000.12.11
申请人 MITSUBISHI ELECTRIC CORP 发明人 WATABE TAKESHI
分类号 H01L21/52;H01L23/08;(IPC1-7):H01L23/08 主分类号 H01L21/52
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