WAFER EDGE CLEANING APPARATUS AND METHOD THEREOF

摘要

PURPOSE: A wafer edge cleaning apparatus is provided to increase a yield and to prevent residues on the side and edge portions of the wafer from being operated as a particle source by selectively perform a CMP(Chemical Mechanical Polishing) on only the edge portion of the wafer. CONSTITUTION: A wafer edge cleaning apparatus comprises Teflon plates respectively installed edge portions of a front and a rear surfaces of a wafer(10) at 90 degrees intervals, four pairs of polishing pads(20) sticked to the Teflon plates, four pairs of nozzles(30) respectively installed on one side of the Teflon plates, and a number of a nitrogen nozzles(40) installed to be fixed to the lower nozzles(30) on the rear surface of the wafer(10) for preventing a penetration of a slurry to the rear surface of the wafer(10).