发明名称 |
SUBSTRATE AND MODULE |
摘要 |
The invention relates to a substrate (S), comprising at least one first insulating layer (1), at least one high-frequency structural layer (4) that contains a high-frequency distributor network, at least one low-frequency structural layer (3) into which a voltage signal can be feed at the input side, the high-frequency structural layer (4) being separated from the low-frequency layer (3) by the insulating layer (1). |
申请公布号 |
WO0201639(A3) |
申请公布日期 |
2002.06.27 |
申请号 |
WO2001DE02373 |
申请日期 |
2001.06.27 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT;HEIDE, PATRIC;DABEK, ALEXANDER |
发明人 |
HEIDE, PATRIC;DABEK, ALEXANDER |
分类号 |
H01L23/498;H01L23/538;H01L23/66;H05K1/00;H05K1/02 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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