发明名称 SUBSTRATE AND MODULE
摘要 The invention relates to a substrate (S), comprising at least one first insulating layer (1), at least one high-frequency structural layer (4) that contains a high-frequency distributor network, at least one low-frequency structural layer (3) into which a voltage signal can be feed at the input side, the high-frequency structural layer (4) being separated from the low-frequency layer (3) by the insulating layer (1).
申请公布号 WO0201639(A3) 申请公布日期 2002.06.27
申请号 WO2001DE02373 申请日期 2001.06.27
申请人 SIEMENS AKTIENGESELLSCHAFT;HEIDE, PATRIC;DABEK, ALEXANDER 发明人 HEIDE, PATRIC;DABEK, ALEXANDER
分类号 H01L23/498;H01L23/538;H01L23/66;H05K1/00;H05K1/02 主分类号 H01L23/498
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