发明名称 |
INTERCONNECTION OF ACTIVE AND PASSIVE COMPONENTS IN SUBSTRATE |
摘要 |
Interconnection of active and passive components in a substrate built using wafer fabrication techniques increase routing density by using a silicon substrate and using silicon processing technologies to embed interconnects a nd components into the substrate. Implantable medical devices including surge protection, output transistors, and other high power components are interconnected using the substrates. |
申请公布号 |
CA2436990(A1) |
申请公布日期 |
2002.06.27 |
申请号 |
CA20012436990 |
申请日期 |
2001.12.14 |
申请人 |
MEDTRONIC, INC. |
发明人 |
LARSON, LARY R.;FENNER, ANDREAS A. |
分类号 |
H01L23/14;H01L25/16;(IPC1-7):H01L25/16;H01L21/98 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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