| 摘要 |
PURPOSE: A heat bonding method and a heat bonding device are provided to suppress an incidence of faulty products even if manufacturing errors in component parts are not always equal to each other. CONSTITUTION: An inequality relationship among "design value + X2", "design value + X1", "design value", "design value - X3", and "design value - X4", where X1, X2, X3, and X4 are positive numbers. First step(S301), it is checked whether or not the measurement result of the distance D1 between the first mark MA and the second mark MB is greater than "design value + X1" and smaller than "design value + X2". When the relationship is satisfied, a current condition for the heat bonding is replaced to the condition 2(S305), and the instruction to initiate the heat bonding under the condition 2 is issued(S310). |
