发明名称 Bonding data setting device and method
摘要 For facilitating and making more efficient the setting of the operating parameters of a bonding tool that is used to form a wire loop into a desired shape, when an editing handle is dragged, the loop shape of a wire loop line drawing displayed on a display screen is redrawn as a secondary loop line drawing. The values of the operating parameters corresponding to the loop shape of the drawn or redrawn secondary loop line drawing are calculated, and the results are displayed in a parameter list.
申请公布号 US2002079348(A1) 申请公布日期 2002.06.27
申请号 US20010026255 申请日期 2001.12.21
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 KIMURA KAZUMASA;WATANABE HITOSHI
分类号 H01L21/60;B23K20/00;(IPC1-7):B23K37/00;B23K31/02 主分类号 H01L21/60
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