发明名称 |
Verfahren zum chemisch-mechanischen Polieren von Isolationsschichten nach der STI-Technik bei erhöhten Temperaturen |
摘要 |
A process for the chemical-mechanical polishing of isolation layers based on the shallow trench isolation (STI) technology, using a basic polishing slurry which contains from about 5 to about 12.5 % by weight of a colloidal silica abrasive, characterised in that the polishing slurry is applied to the wafer surface at a temperature of about 35 DEG C to about 80 DEG C, increases the polishing selectivity with regard to the rate at which silica is removed compared to the rate at which silicon nitride is removed.
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申请公布号 |
DE10063492(A1) |
申请公布日期 |
2002.06.27 |
申请号 |
DE20001063492 |
申请日期 |
2000.12.20 |
申请人 |
BAYER AG |
发明人 |
VOGT, KRISTINA;PUPPE, LOTHAR;MIN, CHUN-KUO;CHEN, LI-MEI |
分类号 |
C09G1/02;C23C16/44;H01L21/3105;(IPC1-7):H01L21/306 |
主分类号 |
C09G1/02 |
代理机构 |
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主权项 |
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地址 |
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