| 摘要 |
According to the present invention, there is provided a heat treatment apparatus in which the surface of a material to be treated is accurately adjusted to be horizontal with respect to the heating plate or the cooling plate which is provided at the upper portion of a chamber. In this apparatus, gas is introduced into the gap between the fixed portion 7a and the movable portion 7b, and thereby the supporting plate 8 is brought into a condition where inclining movement is possible. The lift pins 9 are elevated, without having a material to be treated W mounted thereon, by driving of the motor 4, and thereby the upper edge of all lift pins is made to push onto the lower surface of the cooling plate 2. The movable portion 7b is fixed with respect to the fixed portion 7a by aspirating the gas, and, keeping this condition, the lift pins 9 are lowered together with the supporting plate 8. After this, a material to be treated W is mounted on the lift pins 9, the lift pins 9 are elevated again, the surface of the material to be treated W is allowed to approach the cooling plate 2. Then, heat treatment is conducted.
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