| 摘要 |
<p>A CMP conditioner for suppressing microscratches on the surface of a semiconductor substrate and for obtaining stable CMP conditioner characteristics. The CMP conditioner by a first mode comprises a support member and rigid grains provided on the face of the support member, wherein the rigid grains are regularly arranged on a face of the support member. The CMP conditioner by a second mode comprises a support member and rigid grains provided on a face of the support member, wherein the rigid grains are arranged regularly on a face of the support member so that the density may decrease outward from inside the support member.</p> |
