| 摘要 |
radio electronic equipment. SUBSTANCE: manufacturing process includes drilling holes in substrate for layer-to-layer junctions, depositing fast-curing adhesive onto wire, fitting wire into holes for layer-to-layer junctions, curing adhesive in layer-to-layer hole accommodating the wire, trimming wire flush with substrate surface, giving mechanical treatment to substrate surface, and setting up conductor circuit on substrate sides; layer-to-layer junction holes are made without contact pads, directly in conductors and contact pads for planar leads of electric and radio components; wire diameter in layer-to-layer junction may be greater than conductor width or it may be smaller than or equal to width of conductor or contact pad for planar leads of electric and radio components; for final procedure printed-circuit board is subjected to mechanical treatment and electrodeposition of metal; shielding metal coat is applied, board is etched, clarified, and given hot tinning. EFFECT: enhanced reliability of layer-to-layer junction, increased density of conductors, as well as of electric and radio components. |
