发明名称 THERMISTOR CHIPS FOR SURFACE MOUNTING
摘要 Thermistor chips are produced by preparing ceramic green sheets, applying an inorganic material such as a glass paste on these green sheets in areas including lines along which they are to be later cut, stacking a plurality of these green sheets one on top of another to obtain a stacked body, obtaining chips by cutting this stacked body along those pre-specified lines and subjecting these chips to a firing process to obtain sintered bodies, and forming outer electrodes on mutually opposite end surfaces of these sintered bodies. A thermistor chip thus produced has a thermistor element having outer electrodes on its mutually opposite end surfaces, and diffused layers of an inorganic material having a higher specific resistance than material of the thermistor element. These diffused layers are formed proximally to externally exposed surfaces of the thermistor element.
申请公布号 US2002080007(A1) 申请公布日期 2002.06.27
申请号 US19990405655 申请日期 1999.09.24
申请人 FURUKAWA NOBORU;KAWASE MASAHIKO;ITO YASUNORI 发明人 FURUKAWA NOBORU;KAWASE MASAHIKO;ITO YASUNORI
分类号 H01C17/30;H01C7/00;H01C7/04;H01C17/28;(IPC1-7):H01C7/10 主分类号 H01C17/30
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