METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A method of manufacturing a semiconductor device by which bondability is improved is disclosed. A multi-chip substrate (7) on which an insulating layer such as of solder resist is formed and which has a first side (7c) and a second side (7d) is prepared. Then, semiconductor chips (1) are arranged on the multi-chip substrate (7). When connection terminals on the package substrate of the multi-chip substrate (7) and pads of the semiconductor chips (1) are heated and wire-bonded, a gas (11) is ejected from a part near the first side (7c) of the multi-chip substrate (7) toward the upper part of the multi-chip substrate (7), and the gas (11) over the upper part of the multi-chip substrate (7) and an organic gas generated from the insulating layer are sucked into a part near the second side (7d) while the wire-bonding is performed, so that the bondability is enhanced.