| 摘要 |
The invention relates to a valuable document containing a chip which is connected via an adhesive to a coupling element for transferring data and/or energy from and/or to the chip. In a first embodiment, the adhesive contains electroconductive particles, which are smaller than the distance between the contact surfaces (5) of the chip (3) to the coupling element (2). In a secon d embodiment, the adhesive conductor contains electroconductive particles, whi ch are soft at a high temperature when the chip (3) is applied to the coupling element (2). In a third embodiment, the adhesive is exempt from electoconductive particles, however, the transferring of data/energy takes places via a capacitively coupled alternating field with high frequencies of approximately 2 GHz. |
