| 摘要 |
A method of manufacturing a microelectronic assembly includes providing a first microelectronic element having a first surface and a plurality of terminals exposed at the first surface, providing a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface, forming a plurality of conductive elastomeric posts which connect each of the contacts to one of the terminals, and injecting a compliant material between the first surface of the first microelectronic element and the top surface of the second microelectronic element to form a compliant layer.
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