| 摘要 |
<p>The connections of an electronic device (1) comprise at least an interface element (3) and at least an electronic component (8), with at least a contact pad and a rear surface fixed on the support. The method consists in: cutting out reserves (20) prior to positioning the insulating member (17) and/or following the positioning of said member (17); positioning the insulating member (17) whether cut out or not, with inner access passage perpendicular to the contact pad and outer access passage perpendicular to the interface element (3) with an upper surface (43) at the active surface (14); deforming the member (17); treating the insulating member (17) so that its adhesive properties are activated; and printing the conduction weld (19) through the reserves, so that it flows through until it is connected to the element (3).</p> |
