| 摘要 |
<p>A sealing resin for flip-flop mounting which has a high reliability of mounting and realizes a reduction in assembly cost and an improvement in productivity when solder bumps mount narrow-pitch semiconductor chips by flip flop system on a mounting board. This sealing resin for flip flop mounting fills the gap between the semiconductor chip and the mounting board when the semiconductor chip is mounted on the mounting board by flip flop system by solder joint to seal a solder joint part. This resin contains epoxy resin, an acid anhydride hardener for hardening the epoxy resin, a flux for removing the oxide films of solder bumps and solder balls on the semiconductor chip and the mount board, and an inorganic granular filler having an average diameter of more than 10νm and less than 20νm.</p> |
