发明名称 TRIM PUNCH FOR TRIMMING PROCESSING OF SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE: A trim punch for trimming processing of semiconductor devices is provided to increase a lifetime and to reduce a manufacturing cost by forming punch blade at both ends of the trim punch. CONSTITUTION: A trim punch for trimming processing comprises punch bars(320) formed with punch blades(321) at both ends and connecting holes(322) on one side of each punch bars(320), and a punch holder(310) having protruding parts(311) on both sides so as to exactly connected with the connecting holes(322). Because the punch bars(320) respectively have two punch blades(321) at both ends, although one punch blade(321) become dull, the other punch blade(321) is immediately capable of be changed, thereby increasing the lifetime of the trim punch.</p>
申请公布号 KR20020050426(A) 申请公布日期 2002.06.27
申请号 KR20000079575 申请日期 2000.12.21
申请人 HYNIX SEMICONDUCTOR INC. 发明人 CHOI, GWANG SU
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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