发明名称 FLEXIBLE WIRING BOARD AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A flexible wiring board and a method for manufacturing the same are provided to reduce manufacturing costs and simultaneously manufacturing a flexible wiring board which is easy to handle. CONSTITUTION: In the manufacturing method of a flexible wiring board, a plurality of first wiring patterns(2) are formed on a copper foil(12) and a plurality of guide patterns(3) are simultaneously formed at the outer-periphery portion of the first wiring patterns(2). Then, an insulating film(14) is formed on the first wiring patterns(2) and the guide patterns(3).
申请公布号 KR20020050704(A) 申请公布日期 2002.06.27
申请号 KR20010079368 申请日期 2001.12.14
申请人 SONY CHEMICALS CORPORATION 发明人 KANEDA YUTAKA
分类号 H05K1/11;H01L21/60;H05K1/00;H05K1/02;H05K1/03;H05K1/14;H05K3/06;H05K3/20;H05K3/28;(IPC1-7):H05K1/14 主分类号 H05K1/11
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