发明名称 |
FLEXIBLE WIRING BOARD AND MANUFACTURING METHOD THEREOF |
摘要 |
PURPOSE: A flexible wiring board and a method for manufacturing the same are provided to reduce manufacturing costs and simultaneously manufacturing a flexible wiring board which is easy to handle. CONSTITUTION: In the manufacturing method of a flexible wiring board, a plurality of first wiring patterns(2) are formed on a copper foil(12) and a plurality of guide patterns(3) are simultaneously formed at the outer-periphery portion of the first wiring patterns(2). Then, an insulating film(14) is formed on the first wiring patterns(2) and the guide patterns(3).
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申请公布号 |
KR20020050704(A) |
申请公布日期 |
2002.06.27 |
申请号 |
KR20010079368 |
申请日期 |
2001.12.14 |
申请人 |
SONY CHEMICALS CORPORATION |
发明人 |
KANEDA YUTAKA |
分类号 |
H05K1/11;H01L21/60;H05K1/00;H05K1/02;H05K1/03;H05K1/14;H05K3/06;H05K3/20;H05K3/28;(IPC1-7):H05K1/14 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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