发明名称 |
Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
摘要 |
A method of manufacturing a semiconductor device comprises a step of mounting a semiconductor chip on a wiring substrate having a base substrate on which are formed interconnecting lines; while melting the base substrate, bumps provided to the semiconductor chip are pressed in, and the bumps are electrically connected to the interconnecting lines.
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申请公布号 |
US2002079594(A1) |
申请公布日期 |
2002.06.27 |
申请号 |
US20010987409 |
申请日期 |
2001.11.14 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
SAKURAI KAZUNORI |
分类号 |
H05K3/32;H01L21/60;H01L23/538;H01L25/065;H01L25/07;H01L25/18;(IPC1-7):H01L21/44;H01L23/48 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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