发明名称 ONE-PACK MOISTURE-CURABLE EPOXY RESIN COMPOSITION
摘要 <p>A one-pack moisture-curable epoxy resin composition which comprises: a carbonyl compound represented by the chemical formula (1) consisting of a carbonyl group and bonded thereto two C2-6 alkyl groups which are the same or different; a ketimine compound represented by the chemical formula (2) synthesized from an amine compound having at least one primary amino group per molecule; and an epoxy resin. The composition combines excellent curability with satisfactory storage stability. (1) R1: C2-6 alkyl R2: C2-6 alkyl (2) R3: organic group R4: C2-6 alkyl R5: C2-6 alkyl n: integer of 1 or larger</p>
申请公布号 WO2002050154(P1) 申请公布日期 2002.06.27
申请号 JP2001011070 申请日期 2001.12.17
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