SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

Circuit elements constituting a circuit, a wiring, and a first electrode electrically connected to the circuit are provided on a major surface of a semiconductor substrate. An organic insulating film is formed on the circuit except the opening made in the surface of the first electrode. First and second external connection electrodes are provided on the organic insulating film. A conductive layer for connection between the first and second external connection electrodes and the first electrode is deposited on the organic insulating film.