发明名称 |
Enhanced die-up ball grid array and method for making the same |
摘要 |
An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second surface. The second stiffener surface is attached to the first substrate surface. An IC die has a first surface and a second surface. The first IC die surface is mounted to the first stiffener surface. A plurality of solder balls is attached to the second substrate surface. In one aspect, a heat spreader is mounted to the second IC die surface. In another aspect, the stiffener is coupled to ground to act as a ground plane. In another aspect, the substrate has a window opening that exposes a portion of the second stiffener surface. The exposed portion of the second stiffener surface is configured to be coupled to a printed circuit board (PCB). In another aspect, a metal ring is attached to the first stiffener surface. In another aspect, wire bond openings in the stiffener are bridged by one or more studs.
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申请公布号 |
US2002079572(A1) |
申请公布日期 |
2002.06.27 |
申请号 |
US20000742366 |
申请日期 |
2000.12.22 |
申请人 |
KHAN REZA-UR RAHMAN;ZHAO SAM ZIQUN;BACHER BRENT |
发明人 |
KHAN REZA-UR RAHMAN;ZHAO SAM ZIQUN;BACHER BRENT |
分类号 |
H01L23/373;H01L23/433;(IPC1-7):H01L23/10;H01L23/34 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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