发明名称 Method of manufacturing bipolar device and structure thereof
摘要 Disclosed are a method for manufacturing a homojunction or heterojunction bipolar device and a structure of the bipolar device manufactured by the method. The method comprises steps of forming a collector on a substrate including a buried collector to be contacted with the buried collector and protruded in the form of an island; depositing a collector dielectric film on the substrate on which the collector is formed; removing a protruded portion of the collector dielectric film covering the substrate; depositing a first semiconductor electrode layer on the substrate including the collector protruded over the collector dielectric film and flatting a surface of the first semiconductor electrode to expose only the collector formed of a semiconductor material and the first semiconductor electrode; and growing a base thin film including one of silicon and silicon-germanium on the substrate on which only the semiconductor material is exposed, thereby preventing the non-uniformity of a thickness of the base thin film, a contain rate of an impurity and a germanium distribution by the loading effect.
申请公布号 US2002079510(A1) 申请公布日期 2002.06.27
申请号 US20000747761 申请日期 2000.12.21
申请人 HAN TAE-HYEON;RYUM BYUNG RYUL;LEE SOO-MIN;CHO DEOK-HO 发明人 HAN TAE-HYEON;RYUM BYUNG RYUL;LEE SOO-MIN;CHO DEOK-HO
分类号 H01L29/73;H01L21/331;H01L29/165;(IPC1-7):H01L21/331;H01L21/822;H01L31/032;H01L31/033;H01L31/072;H01L31/109 主分类号 H01L29/73
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