发明名称 LASER ANNEALING METHOD AND DEVICE
摘要 A laser annealing method for executing laser annealing by irradiating a semiconductor film formed on a surface of a substrate with a laser beam, the method including the steps of, generating a linearly polarized rectangular laser beam whose cross section perpendicular to an advancing direction is a rectangle with an electric field directed toward a long-side direction of the rectangle or an elliptically polarized rectangular laser beam having a major axis directed toward a long-side direction, causing the rectangular laser beam to be introduced to the surface of the substrate, and setting a wavelength of the rectangular laser beam to a length which is about a desired size of a crystal grain in a standing wave direction.
申请公布号 US2010022102(A1) 申请公布日期 2010.01.28
申请号 US20060916687 申请日期 2006.09.12
申请人 IHI CORPORATION;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 KAWAKAMI RYUSUKE;NISHIDA KENICHIROU;KAWAGUCHI NORIHITO;MASAKI MIYUKI;YOSHINOUCHI ATSUSHI
分类号 H01L21/268;H01L21/64 主分类号 H01L21/268
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