发明名称 CURABLE RESIN COMPOSITION, MOLDING MATERIAL AND VISCOSITY ADJUSTER
摘要 PROBLEM TO BE SOLVED: To obtain a curable resin composition containing an alkenylsuccinic acid of a specific structure which has excellent thickening property and thickening stability. SOLUTION: This curable resin composition comprises (a) a curable polymer having 5,500 to 50,000 weight average molecular weight, (b) a polymerizable monomer and (c) an alkylsuccinic acid and/or alkenylsuccinic acid having 8 to 30 total carbons, where the content of (c-1) an alkylsuccinic acid and/or alkenylsuccinic acid having a structure expressed by general formula (1) (wherein R represents an alkyl group or an alkenyl group having 3 to 25 carbons) contained in the curable resin composition to (c) is in the range of 0.8 to 1.0 by weight ratio.
申请公布号 JP2002179746(A) 申请公布日期 2002.06.26
申请号 JP20000374990 申请日期 2000.12.08
申请人 NIPPON SHOKUBAI CO LTD 发明人 MATSUKAWA KENJI;HAYASHI KATSURA
分类号 B29C43/02;C08F283/01;C09K3/00;(IPC1-7):C08F283/01 主分类号 B29C43/02
代理机构 代理人
主权项
地址