发明名称 RESIN COMPOSITION FOR MOISTURE-PROOFING PROCESSING AND MOISTURE-PROOF MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a resin composition for moisture-proofing processing capable of imparting moisture-proof performances superior to those of a polyethylene-laminated paper, having excellent separability of the resin layer from paper in recycling, excellent in resistance to slipperiness and free from omission of wax, and moisture-proof material. SOLUTION: The resin composition for moisture-proofing processing comprises a synthetic resin emulsion or a synthetic rubber latex (A) and a hydrophobic organic resin powder (B) having an average particle size of 1-50μm and a softening point of at least 70 deg.C. The moisture-proof material comprises a substrate having this composition coated thereon.
申请公布号 JP2002179926(A) 申请公布日期 2002.06.26
申请号 JP20000380196 申请日期 2000.12.14
申请人 DAINIPPON INK & CHEM INC 发明人 KAKINUMA CHIKAO;KAWASAKI TETSUO;YOSHIKAWA KEIGO
分类号 B32B27/00;C08K3/00;C08L101/00;D21H19/58;D21H21/14;(IPC1-7):C08L101/00 主分类号 B32B27/00
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