| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with which the picture frame part of an LCD module can be made narrower and the semiconductor device is made slimmer. SOLUTION: The semiconductor device is provided with a silicon substrate 3, a segment signal output part 4 formed on the central part of the one side of the longitudinal direction of a silicon substrate 3, common signal output parts 5-6 formed on both sides of the central part, divided power source parts 7-8 formed along the other side of the longitudinal direction of the silicon substrate 3 and opposed to the common signal output parts 5-6, RAMs 9-10 formed between the power source parts 7-8, and a control section 11.
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