发明名称 |
Inspection apparatus and method for electrode plate-connected structure for secondary cell |
摘要 |
<p>The present invention provides an inspection apparatus for an electrode plate-connected structure for a secondary cell for inspecting each bonding portion of an electrode plate-connected structure for a secondary cell including a plurality of electrode plates (11) which are arranged in parallel to one another at prescribed intervals and are perpendicularly connected to a power collecting plate (12). The apparatus is characterized by including: a lighting section (4) for irradiating light to each of the bonded portions of the plurality of electrode plates and the power collecting plate; a light receiving section (5) for detecting a projected image of each of the bonded portions based on the light irradiated to the electrode plate-connected structure by the lighting section; and an evaluation section for evaluating a bonding state of each of the bonding portions based on the projected image of each of the bonded portions detected by the light receiving section.</p> |
申请公布号 |
EP1217357(A2) |
申请公布日期 |
2002.06.26 |
申请号 |
EP20010129102 |
申请日期 |
2001.12.07 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;TOYOTA JIDOSHA KABUSHIKI KAISHA |
发明人 |
NAKANISHI, TOSHIAKI;NAKAGAWA, YUGO |
分类号 |
G01N21/88;G01N21/956;H01M2/26;H01M10/34;H01M10/42;(IPC1-7):G01N21/84;G01N21/95;H01M10/14 |
主分类号 |
G01N21/88 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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