WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING FOR WIRING BOARD

摘要

PURPOSE: A semiconductor device in which a semiconductor chip has been mounted on its wiring board can be thinned and a height extending from a mount board to the top surface of its semiconductor device can be reduced in the case when the semiconductor device wherein a semiconductor chip has been mounted on its wiring board is mounted on the mount board. CONSTITUTION: A wiring board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principal plane of the insulating substrate, and a conductive member to be connected with the connection terminal of the electric wiring is disposed inside the opening, which comprises the conductive member having a thickness from a surface on which the electric wiring of the insulating substrate has been disposed being thinner than that of the insulating substrate.