发明名称 |
SEMICONDUCTOR WAFER LEVEL PACKAGE |
摘要 |
A semiconductor wafer level package used to encapsulate a device fabricated on a semiconductor substrate wafer (11) before dicing of the wafer into individual chips. A cap wafer (16) may be bonded to the semiconductor subtrate using a low temperature frit glass layer (14) as a bonding agent. The frit glass layer (14) is in direct contact with the device. A hermetic seal is formed by a combination of the semiconductor substrate wafer (11), the cap wafer (16) and the first glass layer (14). A second embodiment of the package (21) does not contain a cap wafer. |
申请公布号 |
EP1216487(A1) |
申请公布日期 |
2002.06.26 |
申请号 |
EP20000961925 |
申请日期 |
2000.09.15 |
申请人 |
MOTOROLA, INC. |
发明人 |
XU, DAXUE;HUGHES, HENRY, G.;BERGSTROM, PAUL;SHEMANSKY, FRANK, A., JR.;TSOI, HAK-YAM |
分类号 |
H01L21/52;H01L21/54;H01L21/56;H01L23/04;H01L23/10;H01L23/29;(IPC1-7):H01L23/04 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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