ADHESIVE SHEET FOR SEMICONDUCTOR AND PART AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To industrially provide an adhesive sheet for a semiconductor device having excellent reflow resistance and processability and improve the reliability of the semiconductor device for surface packaging. SOLUTION: This adhesive sheet for the semiconductor is characterized in that (A) a protective film layer satisfies characteristics of the following (1) to (2) in the adhesive sheet comprising at least one layer of the protective film layer (A) and (B) an adhesive layer. (1) >=75 and <=250μm thickness and (2) >=0.5 and <=10 GPa modulus of elasticity.