IMPROVED THERMAL DISPERSION STRUCTURE OF FLIP CHIP MODULE

摘要

PURPOSE: An advanced thermal dispersion structure of a flip chip module is provided to increase dispersion efficiency of the flip chip module by using an epoxy resin with a material having prominent conductivity such as copper, silver, and aluminium to seal fully the flip chip module. CONSTITUTION: A plurality of solder balls(111) are formed on a bottom of a flip chip module(1). The flip chip module(1) includes a packaged substrate(11). A solder bump(211) is fully sealed by using a filling agent(31). The flip chip module(1) is fully covered by using the epoxy resin(41). Accordingly, a distance of thermal transfer path is reduced since the epoxy resin(41) is directly contacted with a chip(21). In addition, thermal dispersion efficiency is increased by reduction of the distance of thermal transfer path.