| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in resolution, adhesion, sensitivity, plating bath contaminating property and product stability. SOLUTION: In the photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in a single molecule and (C) a photopolymerization initiator, a compound of formula (I) and a tris(dimethylaminomethyl)phenol derivative are contained as the component (C) by >=0.005 pt.wt. based on 100 pts.wt., in total, of the components (A) and (B). |
