| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing an epoxy resin composition for sealing optical semiconductor elements, enabling a favorable molding operation to be carried out with slight burrs or cells or the like through securing necessary viscosity in the molding operation even if compounding no filler. SOLUTION: This method for producing an epoxy resin composition for sealing optical semiconductor elements, comprising an epoxy resin, a curing agent and a curing promoter, comprises the 1st step of melt blending the respective components together and the 2nd step of adjusting the viscosity of the resultant molten blend at a specified temperature. |
